fail.....
you need to maximize the surface area and create turbulence, this gives you 'mixing' events inside the liquid and increases your cooling
What might work is something like a miniature heatsink fins fixed to the bottom plate with the top plate fitting over them so that there are fins inside your flow channel, that would maximize your surface area.
Heat is absorbed by the bottom plate, into the fins, which then have the water swirling about them.
Thats pretty much what dogie already brought up and icoin responded to, something like fining on the plate is needed to increase surface area. The form of the channels could also be modified to promote better flow conditions in the fined areas.
Just noticed something in the photo's with the port positions, they would hit either the case or the electrical connectors. Guessing the ends of the plate are the only safe option for them.
EDIT: Was forgetting the heatsinks go on the back of the boards so there's room for the ports at the top (behind the power supply sections), that means the plate would have to be machined to only contact the underside of the chips too though :/
The idea is to hook the cooler in direct contact with the chips, but you bring me back to my original single unit type configuration
A Avalon module is made out of 8 single units mount on a cooler. Each unit can have its own QCool element with in and outlet that would mean 8 times in and 8 times out. 24 or 32 connectors for just outlets needed.
Can you please make a drawing, of how you envision the connection to the water reservoirtank and radiator - a forsided bar drilled, with 8 1/4" inlets and one 1/2" outlet ?
We actualy have no solid data to work with, thats why it would be great if someone of the existing AVALON users could post some measurements.
Thank you!
My questions to BitSyncom still are:
A. Are we gonna be able to get just the PCB parts from AVALON without the aluminium stuff, PSU and fans?
B. Will the design of 28nm be similar to avalon so the cooler can be reused?
