Author

Topic: No Comeback For FPGA Boards, Blackminer F1 (Read 316 times)

legendary
Activity: 1245
Merit: 1004
February 09, 2019, 07:51:56 AM
#3
So, any ideas how to improve this design? Bigger heatsinks? Additional lamination on the boards?

Moar boards. For easier replacement of single failed chips. So you don't have to accept beeing 2 of 6 in a defunct state because 4 still left running. There are 12 inside, the material costs for placing them on 6 Hash boards instead of merely 2 are negligible.

The older designs had been the better ones. Except installation layouts, sometimes (depicted) (not mine)

sr. member
Activity: 428
Merit: 250
Inactivity: 8963
February 01, 2019, 07:22:20 AM
#2
So, any ideas how to improve this design? Bigger heatsinks? Additional lamination on the boards?
legendary
Activity: 1245
Merit: 1004
January 31, 2019, 11:56:35 PM
#1
There is a modern design of old technologie available, these casings are best industry practice.



Overall containing a dozen huge FPGA (not ASIC!) chips, 6 on a single Hash board.
Just from my (outdated) experience running ZTEX boards, those who closely assembled a Cairnsmore1 device:

They did not last for long, old devices usually featured 3 of 4 chips remaining and 1 dead chip which was not replaceable. Placing 6 on each Hash board requires perfect cooling conditions.

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