Prob early crappy chip with several dead engines. That said, it should prob be fine if you keep it cool and don't fuck around with it.
It's running pretty cool between 19C to 25C. But I am concerned about the exposed edges on the die.
Topic: BFL 5GH/s Jalapeno received today, Chip Die jagged edge question - page 2. (Read 4377 times)
Prob early crappy chip with several dead engines. That said, it should prob be fine if you keep it cool and don't fuck around with it.
It's running pretty cool between 19C to 25C. But I am concerned about the exposed edges on the die.
They switched packaging facilities afaik. Maybe one is from the new one?
Cheaper but less precise I take it?? One more closed photos of the faulty chip to see it better
Will take more close-ups tomorrow
I think it's a dummy
It sure does look like a dummy chip to me. It is required to balance the heatsink for parallel contact with the hashing chip.
Have anyone tested that hypothesis by running it for a while, turn off and check for temperature-variations between the chips?
Perhaps maybe they cut the wafers with a butter knife? Hence the jagged edges? 
One more closed photos of the faulty chip to see it better
I think it's a dummy
It sure does look like a dummy chip to me. It is required to balance the heatsink for parallel contact with the hashing chip.
Prob early crappy chip with several dead engines. That said, it should prob be fine if you keep it cool and don't fuck around with it.
How much?
When You had order it?
Bought it in auctions.
When You had order it?
Why is one edge jagged? Will it affect longevity of the Jalapeño?[/img]
AFAIK, it won't effect longevity per se. There might be some weird temperature gradients around the edges, but keep it cool, and that thing should have a long life and die in bed. You are looking at the problems bfl encountered with bumping/packaging houses. One good chip from most recent suppliers and one older chip which is bolloxed up but works.
Quite likely, the jagged edge chip looks more like a home project. I have never seen such workmanship even in engineering samples.
yeah not a very good job of under fill for that other chip
You are looking at the problems bfl encountered with bumping/packaging houses. One good chip from most recent suppliers and one older chip which is bolloxed up but works.
Cause that chip is used one, like BFL FPGAS used ones second hands....
maybe one chip is 3.5G and the another one is like 1.5 to 2 G/hash that's why they asking for 7Ghashes devices, cause 1.5 to 2 G/hash are limited stock.
maybe one chip is 3.5G and the another one is like 1.5 to 2 G/hash that's why they asking for 7Ghashes devices, cause 1.5 to 2 G/hash are limited stock.
Perhaps because it is of an older version, probably a prototype chip...
Just received it today.
Did you upgraded to 7 GH/s? What value did you got with a mining software?
It's 5GH/s, mining s/w reports 5.1 - 5.2 GH/s
Is it a 5Gh/s version? Maybe the 7Gh/s version has 2 larger chips?
It's a 5Gh/s version
Perhaps because it is of an older version, probably a prototype chip...
Just received it today.
Did you upgraded to 7 GH/s? What value did you got with a mining software?
Is it a 5Gh/s version? Maybe the 7Gh/s version has 2 larger chips?
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