Topic: BFL ASIC STATUS with pics(UPDATED) (Read 9385 times)

Blind Faith Laboratories

15 March 2013 Update

It's been a long couple days here at the labs! Trying to test the chip in the test rig has been exceptionally trying and it turns out it's due to a bad socket on the tester. Initially we were concerned there might be a problem with the bumping or substrate, but fortunately we had tested the chips prior with the wire bonding technique, so we knew they worked. Getting the test boards made proved to be fortuitous as well, since we were able to bypass the test rig completely and bring the chips up on the board. By doing so, we were able to finally identify that the problem was related directly to the test rig and not any intermediate process or step.

Bringing a chip to life in situ on a board is not the easiest thing, so it has been slow going. The chip was responding properly on the board late this afternoon and we will be picking up the process in the morning. We hope to have a more complete test by Saturday night or Sunday sometime. Meanwhile, we will also be hard soldering a chip into place for use in the test rig and replacing the socket to allow the bulk testing to finish. In some other positive news, we've not found a single bad chip yet, which could mean our yield rate will be exceptionally high... maybe we just got lucky out of the 50 chips we have available on boards so far, but it seems unlikely. So that may mean the vast majority of our chips will be usable.

So the good news is the boards work, the chips work, the bumping works, the substrate works. We just need to nail down a bit more with the firmware and we should be able to conduct a full test and start shipping.

I will be posting another update as soon as I have more information. Needless to say it's been a pretty busy and stressful last few days here, and some script kiddie deciding to DDoS our sites this morning didn't help matters. All connectivity problems should be resolved now and we will keep people updated as time allows.

I cant wait to see them running

You gotta be f***** kidding?

I think Josh mentioned something about looking into the idea of offering something between a Single and Mini Rig....Micro Rig for 10,000 would be good here.

Where are the numbers BFL?

Yes as they are both inductors.


Regards,
Nasser

Ok, let me rephrase that: You can't make BGA packages replaceable without incurring unreasonable cost and heat/connection problems.








....See Bitcoiners clamoring for BFL to add 16000 Dollars worth of sockets to each PCB in 3...2....1

Wrong. There are sockets for BGA packages. But they are expensive and heat is a problem with those sockets. The socket we used in our last ASIC project was about 1000-2000 USD.

You can't make BGA packages replaceable, no.

could asic chips be made easy replaceable like a regular CPU?

(apologies for quoting myself, but done so purposely to have the above images on this new page, coupled with coinciding with the below follow-up)

I just figured it out. Somebody, correct me if I'm wrong. The bottom photo looks definitely shopped, with the markings placed on some components.

The eight chips in the bottom image are just shopped coloring. I'm going to put on my worn out tin foil hat now. Either the "smudged" chip was put there on purpose to start a conversation leading to it being blown because... Or it was an 'honest' error during the shopping process, and when it was pointed out, it was transformed into another opportunity to further the delay.

There seems to be a myriad of minor differences between these two boards. Bear in mind that the top board was photographed at an angle, whereas the bottom board was photographed straight down. Yet the markings in the top photo are clearer than the ones in bottom image, but for only some of the components--not all. In fact, in the bottom image, I'm able to read the fine print next to the resistors better than I can read the number 470 on those components, and I have bad eye site. Now, compare the 470 components between both boards.

It's gonna be hot that's for sure, lets say 90°C... Why still no confirmation of a working device?

Cropped and oriented. Now compare.

Are those C451 and 2R2 components bidirectional?




(click for larger size)

Cant wait to see the screen shots or video of it running

The new boards look slightly different than the old boards. (images are linked to view larger sized)

What's withvall these wirebonds? I thought they were going the flip chip bga way...?

... and as far as I've read, that's exactly what they're doing (thermal pad).  I'll bet it works out.

lol, instead of 32 BTC, you get 32 pieces of shrapnel in your left butt cheek. That is the true scam here folks - truth is stranger than troll fiction.

looks good, but how it works?