Just a random googled chip image not HashFast processor.
The shinny metal part is the actual die (produced on wafers at a fab like TMSC, cut into individual dies).
The greenish particle board looking part is the substrate.
The entire thing is what most people call "the chip". For high powered processors the die and substrate will be covered by a metal lid which acts as a heat spreader.
So whatever the issue with the substrate is, they are needed in the step called "packaging" where completed wafers are cut into dies, attached to substrate to form complete packages ("chips").
Processor/chip = silicon die + substrate + package lid + packaging labor