Topic: How Thermal Compound Spreads - page 2. (Read 2671 times)
Always spread it with fingertips on the heatspreader/GPU.
Notice how none of those cover the edges of the cpu. Now pretend that CPU is a bare die. If you can't see the problem with a bare die not being covered completely you shouldn't be messing with your heatsinks. For a bare die the best method is to paste it in an X from corner to corner of the die with more than enough paste than you will need so you will know 100% of the die will be covered.
Yeah I've tried the spread method before, had 80+ temps idle with a core2. Was terrible, really hard to avoid air bubbles that way. I went with the line after that and with a new cooler it brought it to 44-46 under full load.
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Sorry, this forum does not support those tags. You have to link as usual.
Just a test, 'ehh'. With SMF they are add-on modules not standard build items. 
That is an excellent video displaying what took me something like 40-50 mounts to figure out. That should pretty much end the argument for the spread method. My only complaint is that he used a little bit less paste than I'd use. I like a little excess to squeeze out to get full coverage on the IHS.
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