With a CPU you have a single heatsink which mounts to the flat heat spreader and applies a lot of pressure.
With a GPU the heatsink covers multiple components and is tightened down with multiple screws. Very hard to get the same amount of direct pressure on the GPU die.
The other advantage of CPU is the heat spreader is larger than the chip surface so if thermal compound doesn't get all the way to the corners it doesn't really matter because there is no heat source there. With GPU what you see is the actual chip package and even the corners are putting out significant amount of heat.
For CPU the single grain of rice method works fine. For GPU I use the thin line and spread with a credit card. It doesn't need to be perfect the heatsink will apply some pressure and spread it out.
Still regardless of the method you want as little as possible. I try to get it thin enough that it looks almost translucent.
Nope... Grain of rice method does not work for any bare dies. It leaves the edges bare like you said.
I use an X method which works fantastic. Two thin lines in an X shape from each corner of the die. Spread method works good too. Really, any method will work as long as the die is covered.