Is there enough spacing between the modules to put gpu ram sinks on each individual chip? I have about 2 kg of them, yes kilograms
Infact just checked how much the bag of them weigh, it was close to 4 kilograms so I should have plenty for 1x3 module avalon once I get it.
I was thinking people should replace the thermal compound used in the Avalon unit. Considering there are some people who found out some units have no thermal compound or had it improperly applied.
Assuming that the thermal compound is crap and/or low efficiency, then transferring the heat from the chips to the heatsink would probably help some at higher clocks. A good number of thermal pads with 6 or 7watt/mk should help alot if this is the case. (It would be the equivalent to MX4.)
The next problem after that is how (in)efficient the heatsink actually is at discharging the heat with the current design.
Then finally finding an air temperature that allows the heatsink to work at a reasonable pace. (not too cold because it costs $$$ to keep it at that temp)
etc
The exposed metal area under the chips are shallower than the surface of the PCB, if you put a large piece of heatpad then maybe there will still be air gap between the metal part and heat pad, and you can't guarantee a good pressure on all the chips' contact area at the same time, so I think thermal compound is the solution: You put one big drop of the thermal compound on each metal area, and tighten the screws, the thermal compound will spread out depends on the gap distance between chip metal area and the heatsink, so that every chip will get a good contact with heatsink
The result of this handling is reduced temp of 3-4 degree under same fan speed, but since fan speed will always adjust according to temp3, the real effect is just lowered fan speed and maybe 1 degree lower temp. Anyway, you can be sure each chip get maximum cooling now. Then you can also add thermal compound between heatsink and bottom of the case, and cool the bottom of case with an external table fan, this can drop another 3 degree of temp
Another important part is putting screws around VRM area, there is a very hot component at this area, MOSFETS maybe, but not like chips, this component only contact the surface ground layer of PCB, so adding screws will transfer the heat from the surface ground layer directly into heatsink
Since Avalon heatsink are so large, maybe it works even better by taking out those modules and use a large table fan to directly blow on them, or mount many 120mm fans on heatsink like someone did on ASIC miner blades, as long as you reach a certain CFM, the cooling effect should be the same. I usually like the bigger fan solution since it will provide much more airflow and much less noise
of course, that's not really possible on just air cooling.
