Took me from 21st of May until now, almost 8 weeks later!
Is the plumbing to each block in serial or parallel?
Topic: Avalon Water Cooling - page 2. (Read 13967 times)
Is the plumbing to each block in serial or parallel?
Took me from 21st of May until now, almost 8 weeks later!
What a great job you did, I thank you sincerely share the results.
Thank you for your posting. Just for you the following pictures:
And look what they changed for batch3:
What a great job you did, I thank you sincerely share the results.
A contribution, if you want to put 2 PCBs in one block, turn the pcb so that each "backplane" stay in a different side of the block.
A contribution, if you want to put 2 PCBs in one block, turn the pcb so that each "backplane" stay in a different side of the block.
Did you do anything to control the thermal compound layer thickness in those tests?
No
Quote
I removed all my PCB's from the heat sinks once more and applied thermal compound
- Based on my own experience, I can only say that MX-2 is not quite effective thermal compound.
I do believe that Zalman ZM-STG2 could be a better choice for you:
But it seems I'm late with my good advice.
Let me get you your daily fix of pr0n:
No pics of the illustrious cavity though
No pics of the illustrious cavity though
Thank you
Dollars to donuts it's a plain vanilla package, and cheap alum. video ram heatsinks would improve air cooling for almost no money/time/risk.
*I don't own an avalon rig, perhaps due to wagering dollars against donuts too often.
Also idle curiosity, i like silicon pronz.
Let me get you your daily fix of pr0n:
http://zeptobars.ru/en/read/avalon-bitcoin-mining-unit-rig
No pics of the illustrious cavity though
Just wiki or read many pdfs available regarding QFN package design. You will get the general idea, yes under the plastic they are hollow the die sits inside and has "metal support beams" (forgot exact term) that go through the PCB to the thermal pad on the opposite side of the PCB. Heat is distributed to the surface of the PCB & to that metal thermal pad.
I've cracked many open when i was a kid
Never seen one with a cavity inside, that's why i was curious. I have a hard time imagining why such a cavity would exist, considering how the things are typically made (you can see the resin being poured in one of the frames):
They're all pretty much like this:
So whatever the plastic/resin is used on the topside is in direct contact with the die. The second gif is, obviously, not to scale, so the plastic on top of the die is not much thicker than the PC board. In other words, if there is no air cavity (why would there be -- seems much simpler to *not* have one), top-side heatsinks would improve air cooling *a big bunch*
Has anyone decapsulated one of these chips?
Why would anyone want that? Trying to figure out how hash sha256?
I was simply interested in packaging/heat transfer, that's why i asked in this thread. I think there was a mention of "hollow" somewhere, a warning against top-side heatsinks, wanted to find out if that was the case. Also idle curiosity, i like silicone pronz.
Just wiki or read many pdfs available regarding QFN package design. You will get the general idea, yes under the plastic they are hollow the die sits inside and has "metal support beams" (forgot exact term) that go through the PCB to the thermal pad on the opposite side of the PCB. Heat is distributed to the surface of the PCB & to that metal thermal pad.
Has anyone decapsulated one of these chips?
Why would anyone want that? Trying to figure out how hash sha256?
I was simply interested in packaging/heat transfer, that's why i asked in this thread. I think there was a mention of "hollow" somewhere, a warning against top-side heatsinks, wanted to find out if that was the case. Also idle curiosity, i like silicon pronz.
Edit: Spelingz -> silicone
Has anyone decapsulated one of these chips?
Why would anyone want that? Trying to figure out how hash sha256?
Has anyone decapsulated one of these chips?
so the million dollar question is this -- What's the limiting factor here?
Is it just cooling?
Do we need to overvolt?
Is the Avalon designs (and other ones being designed(?)) capable of the increased current draw, not capable of a fast enough transient response, not enough decoupling caps?
Or are we running into a brick wall due to the internals of the ASIC chip itself?
Is there anything stopping a design with water cooling and upgraded power regulator/decoupling from breaking 450 MHz?
Is it just cooling?
Do we need to overvolt?
Is the Avalon designs (and other ones being designed(?)) capable of the increased current draw, not capable of a fast enough transient response, not enough decoupling caps?
Or are we running into a brick wall due to the internals of the ASIC chip itself?
Is there anything stopping a design with water cooling and upgraded power regulator/decoupling from breaking 450 MHz?
Love the effort put into the water cooling blocks. I would maybe recommend using different cooling fluid than water you have in them tanks and get stuff that is designed to adsorb heat and dispense it. apon hitting cooling as it is actually designed to cool the liquid quicker when travailing into radiator block to cool. Or your next task maybe taking it to a oil cooed rig setup but for water cooling at them terms seems heck of a hell high to me. I am currently working on a few things that I should have up shortly for air cooled for people as I know someone does done the tiniest of mods and now cooling much lower than the water cooling or very close results on air cooled. If I had the money I would go make some water blocks but also have a few ideas too More details later.
More details later.
An even more optimal application of MX-2 might be to do a thin layer across entire pcb first(kinda how it was stock on early samples) .. then apply a tad to each little thermal pad for the chips.
QFN, iirc is designed to not only release heat through the thermal pad but also to the PCB around it - both work as a cooling element for the chip.
QFN, iirc is designed to not only release heat through the thermal pad but also to the PCB around it - both work as a cooling element for the chip.
Ambient is sensor one. That thermal pad was delivered with my batch two unit.
oh interesting...
So, I was thinking, arent the temp sensors attached to the heatsink and not the asic chips themselves?
Given that...if ur thermal transfer effeciency increased by ur application of MX-2 .. shouldnt the heatsinks be a bit hotter as per the thermal sensors??
Ambient is sensor one. That thermal pad was delivered with my batch two unit.
oh I see, that thermal foil, u tried first on ur WC blocks? I didnt even realize the pictures were a WC block =P
Thats pretty nice, whats the ambient @ that clock?
Thats pretty nice, whats the ambient @ that clock?
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