Right now the heat pads on top of the chips ARE NOT THE PROBLEM. read that again. allow it to digest a bit. beath and now continue.
The gridseed chips have THERMAL VIAs to conduct the heat from the chip TO THE BOTTOM HEATSINK! yes thats right the bottom heatsink. SO to really improve your thermal conduciviy you need to be more concerned about the thermal vias, which are located on the underside of the PCB! remove the screww in rises - yeah thoose things that the screw went into. NOW USING SOMETHING PLASTIC VERY CAREFULLY lever the pcb away from the bottom heat sink. i say carefully as it can and probably is stuck there, from use and the stock thermal pad gettting warm and cooling etc. DO NOT USE METAL.
Now stop re read thoose last two sentences let it sink in. and continue - trust me been there done that, seriuosly screwed up my phone! dont risk it! Metal can and 99.999999% will damage the PCB especially the solder shield underneath it and maybe even create a short you didnt want.
Now once youve removed it toss the stock heat pad - if you want - check the thermal vias, they might need reworking, mine did, i had solder oozing out of one and a noticeable air pocket on the other - i heard the air being pushed out as i was handling it! so check your thermal vias. Highly recommend appling a very generous amount of thermal paste to the thermal vias. this will make sure you have good thermal conducivity there as the paste heats itll flow into the vias creating a good thermal conduct.
Now if your going the route of thermal pad no problem cut it out apply to the underside surface of the PCB and reassemble - take note of the milled out portions in the heatsink and there corresponding alignment to the PCB.
IF your going to cover the whole surface in thermal paste, then cover the serveral exposed copper surfaces - com3, reset switch and a few other, wiht electical insulation tape. you dont want thoose to be short on the heat sink, especially the reset switch!
Apply your paste and reassemble again taking note of the cut outs.
Sorry no photos at the mo. its late and i aint stripping my grid down now, but tomorrow i plan on doing so so hopefully - kids permitting- i can get it stripped and do a few photos.
Or you can wait a few post and see what wolfy has to say - prob no need to change the pads thermal paste crap etc etc.
Pads, or paste your choice id recommend adding paste to the vias though either way. just use care and caution when separating the PCB from the bottom heatsink.
Good job Amix,...You are completely correct...!
I am glad to see that more people are paying attention to the thermals and the proper cooling of these babies...Like you, Nemercry ...to name a few...It is IMPORTANT if you want to run your miners for 24/7 in a longer term...
In case somebody missed ...below is my first post on the subject from April 2 ...:
https://bitcointalksearch.org/topic/m.6027770
BTW it was blatantly copied with almost no modifications by some popular bloggers around the net...like this ...:
http://gridseed-blog.com/gridseed-overclocking-1000-mhz-without-voltmod/
Everybody is free to decide what to use ...or not...
ZiG
EDIT ...: @ gtraah ...NO SHIMS on the BOTTOM part ...you will make a SHORT and BURN you device...