I'm having a problem with an S3 I got from Florida. It consistently runs slow. I've just replaced the thermal paste, front and rear of both boards, and a single ASIC is malfunctioning. I'd like to know how the o's are positioned relative to the actual ASICs. For instance, looking at the miner from the RJ45 port end, is the top row of o's the right board? And then is the first o the ASIC closest to the RJ45 port then progressively around so the last o in the line is the ASIC beneath the ASIC closest to the RJ45 port. If this is the case then does the lower line of o's have the first o representing the top ASIC at the far end of the left board, farthest away from the RJ45 port? If not, how? Thanks.
soy
soy
I note that the hashing board on the left while facing the RJ45 port seems to have been a problem. The screws from the board to the inside heatsink were grossly overtightened to the point 2 were almost impossible to remove. When I got the heatsink off there was more thermal paste than on the the other hashing board. The other hashing board has paste that was more dry. This second with the over tightened screws had fresh paste.
I just worked on the second, over tightened screws board again. Cleaning the ASIC of paste on its pins and closing it up, it's been up a little over 5 minutes but running slow, 432.03GH/s(5s) 418.33GH/s(avg) but all ASICs are showing o's.
