Question to someone adept in thermal paste application:
1. If you take the heat sink off and see that paste is applied OK by Bitmain, can you just slowly plop the heat sink back, or you HAVE to clean up and reapply new paste?
2. How much of AS5 to apply? I tried to do it on the first machine (too early to know the results) and you can actually spread it very thin with a rasor blade or exacto knife.
3. When it stabilizes after the application as far as thermal transmission is concerned? AS5 manual talks about something happening in ~25hr and something else in ~200hr.
Air bubble can enter in between. So never ever try that. Clean it and apply a "proper" thermal grease.
Just put a medium pea size on all the ASICs and place the heatsink, screw it up.
Spreading if not done properly will invite bubble in between the heatsink and thermal paste layer and hinter effective heat transmission.
Also, never use a thermal pad in S3 since the heatsink is a lengthy one touching ASICs here and there, possibility of a bad contact is higher.
Stabilisation depends on the quality, type and brand of the thermal grease.
Bitmaintech's engineer advised me to use "Dow Coining Thermal Paste Grease" or one which have conductivity above 3.
, The other 2 will run stable at 237.5 (483 ghs)
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