ASICMINER: Entering the Future of ASIC Mining by Inventing It - page 414.

antirack

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Quote from: rudi on April 21, 2014, 06:34:49 AM

Quote from: antirack on April 21, 2014, 06:22:14 AM

Quote from: rudi on April 21, 2014, 05:21:48 AM

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

No, that's not what it means.

The price difference at the packaging factory is probably marginal between the announced 7x7 or 8x8 mm or 9x9 mm (that's what they went for for now) QFN packages. But for board designers who have to worry about the thermal aspect, bigger is always better when it comes to heat sinks. And that's what the pad is, a heat sink that transfers the heat to the PCB.

It means AM is just trying to do a better job than their competition.

Grin

MichaelBliss

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Quote from: rudi on April 21, 2014, 06:34:49 AM

Quote from: antirack on April 21, 2014, 06:22:14 AM

Quote from: rudi on April 21, 2014, 05:21:48 AM

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

No, it means you are speculating and attempting to draw conclusions without enough information to go on.

necro_nemesis

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Increased thermal transfer and VSS conduction. Through the package selected. Assume the wafers performed favorably at high clock speeds and can be pushed. As everyone would like to see comprehensive test results including various modes of operation under differing cooling conditions.

Quote from: rudi on April 21, 2014, 06:34:49 AM

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

I assume an EE could calculate how much capacity this area would relate to but it may be a function of heat dissipation.

The main takeaway is we're soldiering on which is an indication of the ASICs viability.

rudi

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Quote from: antirack on April 21, 2014, 06:22:14 AM

Quote from: rudi on April 21, 2014, 05:21:48 AM

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

antirack

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Quote from: rudi on April 21, 2014, 05:21:48 AM

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

rudi

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Merit: 100

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

antirack

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Quote from: freedomno1 on April 21, 2014, 02:09:45 AM

Not sure if I recall someone discussing this already or not, but what is your opinion on the Samsung GlobalFoundaries partnership and will it have any impact on future chip releases from Asicminer? Not a wafer person so hopefully not just asking a weird question.

http://www.theregister.co.uk/2014/04/17/samsung_globalfoundries_ink_exclusive_multiyear_14nm_finfet_deal/
http://online.wsj.com/news/articles/SB10001424052702304626304579508052587689582?mg=reno64-wsj&url=http%3A%2F%2Fonline.wsj.com%2Farticle%2FSB10001424052702304626304579508052587689582.html

Samsung and GlobalFoundries have announced a collaborative agreement that will enable 14-nanometer FinFET chippery to be manufactured at Samsung's fabs in Hwaseong, South Korea and Austin, Texas, as well as at GlobalFoundries' fab in Saratoga, New York.

"This is a paradigm change to the foundry landscape," GlobalFoundries VP of product management Ana Hunter said in an announcement video.

http://vimeo.com/92152458

It doesn't matter, sooner or later ASICMiner will take over both of them.
(and then move on to make 3D mutli-stack 14nm Bitcoin ASICs)

Grin

freedomno1

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Learning the troll avoidance button :)

Not sure if I recall someone discussing this already or not, but what is your opinion on the Samsung GlobalFoundaries partnership and will it have any impact on future chip releases from Asicminer? Not a wafer person so hopefully not just asking a weird question.

http://www.theregister.co.uk/2014/04/17/samsung_globalfoundries_ink_exclusive_multiyear_14nm_finfet_deal/
http://online.wsj.com/news/articles/SB10001424052702304626304579508052587689582?mg=reno64-wsj&url=http%3A%2F%2Fonline.wsj.com%2Farticle%2FSB10001424052702304626304579508052587689582.html

Samsung and GlobalFoundries have announced a collaborative agreement that will enable 14-nanometer FinFET chippery to be manufactured at Samsung's fabs in Hwaseong, South Korea and Austin, Texas, as well as at GlobalFoundries' fab in Saratoga, New York.

"This is a paradigm change to the foundry landscape," GlobalFoundries VP of product management Ana Hunter said in an announcement video.

http://vimeo.com/92152458

romerun

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Bitcoin is new, makes sense to hodl.

MOOOON

antirack

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Quote from: minerpumpkin on April 20, 2014, 10:27:51 PM

Friedcat, what's the consumption, price and availability date?

I believe the power consumption will somewhat depend on the PCB implementation and the DC to DC power circuit on the board. I expect there will be boards with slightly varying power consumption.

The only thing we know today is preliminary numbers from Rockxie who did some test boards, but he had some (unrelated to BE200) component troubles. He did not post his final results yet as far as I know.

minerpumpkin

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A pumpkin mines 27 hours a night

We need to dissect any possible differences to prior information. Friedcat, what's the consumption, price and availability date?

antirack

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Friedcat has spoken:

Quote from: friedcat on April 20, 2014, 10:16:22 PM

Update

The documents as well as the (verified & produced) sample design are out:

Schematics - https://mega.co.nz/#!uNMkFZoI!lnlRehlynQQzNRfQ87_UYek1RtrOUvLZ6a074XeRqlo

Reference PCB File - https://mega.co.nz/#!DZVHgS6D!6pmTsmrito8rfVJJ-etvznOtUcalbAT6vU-C8EqY0_I

datasheet - https://docs.google.com/document/d/1_dmXzyMqtr7tVZukk2DAJih2sRq5jDy5DQPkwCce570/edit?usp=sharing

bonding list - https://docs.google.com/spreadsheet/ccc?key=0Al1fvFT7Sd5bdFFZSUllNW5seVRfM01kcDVqZkJfdFE&usp=sharing

9x9 package pictures -
https://drive.google.com/file/d/0B11fvFT7Sd5bUV90cFN4cEhTNEk/edit?usp=sharing
https://drive.google.com/file/d/0B11fvFT7Sd5banZkMDZqSTBGTEE/edit?usp=sharing
https://drive.google.com/file/d/0B11fvFT7Sd5bWjh6MmJsMFpCYkU/edit?usp=sharing

8x8 package picture -
https://mega.co.nz/#!DA1mBJzB!7hFnoT8ZYQd1d30m2oHbuscD36cCQ4ou7stsr5Lo03Y

The package we are using is 9mmx9mm, but it might be partly switched to 8mmx8mm.
Also, we plan to increase the center pad size to at least 7mmx7mm, so please leave enough margin on the PCB to avoid unnecessary re-designs.

freedomno1

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Learning the troll avoidance button :)

Quote from: empoweoqwj on April 20, 2014, 01:21:11 AM

Quote from: tinyfox266 on April 20, 2014, 01:01:50 AM

Quote from: freedomno1 on April 20, 2014, 12:26:52 AM

Quote from: tinyfox266 on April 20, 2014, 12:05:30 AM

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about the current status of the company or gen 3? When it can distribute the dividends again?

all the info is in this thread. just read the last 5-10 pages and you will know what is going on, its not that hard.

That too guess you can stalk Friedcat says if you want as well although it doesn't mention any Rockxie related stuff
https://twitter.com/FriedcatSays

empoweoqwj

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Quote from: tinyfox266 on April 20, 2014, 01:01:50 AM

Quote from: freedomno1 on April 20, 2014, 12:26:52 AM

Quote from: tinyfox266 on April 20, 2014, 12:05:30 AM

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about the current status of the company or gen 3? When it can distribute the dividends again?

all the info is in this thread. just read the last 5-10 pages and you will know what is going on, its not that hard.

tinyfox266

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Quote from: freedomno1 on April 20, 2014, 12:26:52 AM

Quote from: tinyfox266 on April 20, 2014, 12:05:30 AM

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about the current status of the company or gen 3? When it can distribute the dividends again?

freedomno1

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Activity: 1834

Merit: 1094

Learning the troll avoidance button :)

Quote from: tinyfox266 on April 20, 2014, 12:05:30 AM

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

tinyfox266

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no dividends for a couple of weeks. Is there anything wrong?

antirack

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It's coming from the link I posted a page or two earlier.

Wasp uses AM BE200 chips in their hammer boards. So do all the other Asicminer chip buyers.

minerpumpkin

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A pumpkin mines 27 hours a night

Quote from: jimmothy on April 19, 2014, 02:12:21 AM

Quote from: minerpumpkin on April 19, 2014, 02:08:16 AM

Is this immersion cooling proposal directed at hammer ASICs or are we talking about AM as well? This is confusing?

https://bitcointalksearch.org/topic/m.6290126

Should be able to work for any asic/chip.

But where's this coming from? What about those chip specifications? We always stressed how AM was involved with Allied Control immersion cooling

jimmothy

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Quote from: minerpumpkin on April 19, 2014, 02:08:16 AM

Is this immersion cooling proposal directed at hammer ASICs or are we talking about AM as well? This is confusing?

https://bitcointalksearch.org/topic/m.6290126

Should be able to work for any asic/chip.

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