Note that the curled up thing on the top is the chip itself, with little tiny solder dots on it. Also note the mask that connects it to the BGA and the smaller than hair *wires* that go from the chip to the BGA board.
What's happening here is that heat from the top does not flow through the chip carrier; it gets stuck in the top chip. And heats the solder balls under it to the point where they expand and explode out the sides of the chip (seriously I had a little ball of solder on top of the chip). I can't believe that most BGA chips have lots of little wires in there; maybe they do.
The new model seems to be the chip right on top of the BGA bottom. Heat flows through, there doesn't seem to be solder inside, and they never give me a problem.
I think I need to do this with a home-made reflow oven and not air heat. I can only get the bottom up to 375 or so; one option would be to direct the 400c air heat to the bottom of the board under the chip and try to bring that region to 400+. Or something. But man is it a problem to work with these chips.
C
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