Ok, Ognasty was nice enough to take pictures, and I'll upload the key ones here. Or to some sharing site then go from there.
First, the money shot: A shot of the back of the board:
Thought: Holy fuck. That is one serious way to cool down the 12 volt to .6 volt power subsystem. The FETs are on the other side of the board along with the 2708 type gate drivers. At high frequency switching dropping that much one can expect a lot of heat from the high side FETs as they buck the 12 volts down to .6 as they are switching on and off (switching current is a lot more complex than on state current).
That heat sink and fan is covering it all up to the chips. Good idea, but man that is big.
Image number 2 in terms of interesting: This is the switching system for the FETs. Seeing it up close is interesting, the rows of chips in the center are the FET drivers, high and low side. Six channels per side, those bottom chips are probably 6 phase power sequencers. Equally interesting are the little heat sinks covering the high side FETs; wonder how hot those are getting as most of the heat on that style FET is dropped into the board and not out the top (they may be ballast sinks, to react to instant temp/load changes until the board itself saturates the heat and draws it out the back through the copper substrate). Hm.
010NE2LI is a reasonable choice for the low side FETs, you want two because switching issues are minimal on the low side (most of the time they are on to keep the rail close to .6 volts). The high side ones however are another story: You can't put two FETs in parallel because the issue on the high side is gate capacitance. They have to switch from full off to full on *fast* since during the time they are switching they have to drop all of the current at 12 volts going down to .6. Dropping 100 amps at 12 volts will incinerate a FET unless you transition quickly. Thus the lower the gate capacitance the better. Paralleling FETs doubles the current but also doubles the capacitance and leaves the FETs in that state a lot longer.
Interesting.
Then the chokes, and some white stuff, might be the heat sink compound from the chip to water block. Probably more efficient heat transfer than the singles since those had 8 little chips with not much area on top. If this is pulling similar power on one much bigger chip then surface area works in their factor. Hm....
Back of the chip. The temp here would be interesting, they're pulling all the heat up through the chip top and into the heat sink, this would tell how efficient the heat sinks are.
More thoughts later. Very interesting though....