Going over the same thing is getting old.
As for the PCB, I'm not sure why they seem to be having so many issues, KnC and "others" have demonstrated that the PCB is the easiest part of the ASICs. I've even read that documentation they released on how their system would work and even though I'm no engineer in ICs it was pretty clear when it came to describing the functionality. Also it seems that there is enough information for others to start on a design of their own PCB if HF ends up selling just chips.
Hi Timmah
Sam from KnC always tells me that the asic is the easy bit.. and the pcbs are hard!
Sam says 'power in, heat out' are the hardest things to deal with...
That may be true to a certain point, the PCB has to be designed to run the chip and ensure that it produces the best and most Gh/w. I can see how that can be difficult but that is for the PCB designers to work with perhaps some engineers to design the best solution to dissipate the heat from the chip as well as all the other components.
It's obvious that KnC made their 28nm chips with a different design than the other 28nm chips as they had to use 4 boards to get the 400+ Gh speeds which is also another clue as they did not use water cooling or anything like that so that would mean 4 boards with chips may not need water cooling but is right on the edge of adequate cooling for the chips with those huge heat sinks and fans.
Many people opened their cases, installed more fans, etc.
What I meant was that I would think you would need quite a bit more school/skills to develop a good and working IC than designing the PCB for the chips themselves.
I'm not saying they are not smart and all but I would wager that the IC designers get paid more.