For the record I really doubt HF had either the case or power supply custom fabricated. My guess is it is an OEM 2U "deep" (~30" comparing length to board) case and PSU.
This is my thought as well.
Topic: HashFast launches sales of the Baby Jet - page 49. (Read 119626 times)
This is my thought as well.
However, it then raises the question of why the render shows the radiators mounted in the front.
Who says they're at the front? Other than thats where the rack ears are mounted it looks like could go either way. In a lot of facilities its now preferable to have all the cabling on one side in any case.Well that is possible although unless they are using some custom 1U reverse flow PSU, the PSU would still have the airflow in the wrong direction. Just about any case can be installed in either direction but finding a PSU which intakes out the "back" is going to be tough. Also the design really wouldn't make sense reversed. You would have no intake fans and all 11 fans AFTER the obstruction of the boards. Anything is possibly but occam's razoe an all that.
For those wondering what the hell we are talking about here is a mockup of the server.
Note I have no idea what the final unit will look like but looking at the photo "as is" the most plausible scenario is that the edge with the rack ears is the "front", airflow is front to back (in photo above it would be bottom to top) and goes:
font edge (cool aisle) -> 4 pusher fans -> radiator -> 4 puller fans -> 3 midplane fans -> 3 modules on left + PSU on right -> back edge (hot aisle)
Maybe the description is right but the mockup doesn't match the description. For the record I really doubt HF had either the case or power supply custom fabricated. My guess is it is an OEM 2U "deep" (~30" comparing length to board) case and PSU.
FYI to all, 3 day sale is on now at HashFast.. get great discounts on the popular Baby Jet and Sierra.. check the site now for the prices!
https://hashfast.com
https://hashfast.com
I was looking at the Sierras. Possibly you know of the details surrounding the 1U control unit?
FYI to all, 3 day sale is on now at HashFast.. get great discounts on the popular Baby Jet and Sierra.. check the site now for the prices!
https://hashfast.com
https://hashfast.com
However, it then raises the question of why the render shows the radiators mounted in the front.
Who says they're at the front? Other than thats where the rack ears are mounted it looks like could go either way. In a lot of facilities its now preferable to have all the cabling on one side in any case.I don't follow. Are you saying that you feel it's plausible that they've designed the unit to have all cabling exiting at the front and simply have the ears in the wrong location?
I don't think it is two radiators
It is row of pusher 4 fans ---> radiator ---> row of 4 puller fans. Now at this point air pressure is going to be no existent so there are an additional 3 booster fans to increase air velocity over the boards.
Only 1 radiator and 3 rows of fans. Then again we are looking at a crude schematic so who knows. It would be good for HF to clarify the intended design.
It is row of pusher 4 fans ---> radiator ---> row of 4 puller fans. Now at this point air pressure is going to be no existent so there are an additional 3 booster fans to increase air velocity over the boards.
Only 1 radiator and 3 rows of fans. Then again we are looking at a crude schematic so who knows. It would be good for HF to clarify the intended design.
You're correct, I am mistaken. Thanks for pointing that out.
However, it then raises the question of why the render shows the radiators mounted in the front.
Who says they're at the front? Other than thats where the rack ears are mounted it looks like could go either way. In a lot of facilities its now preferable to have all the cabling on one side in any case.
I don't think it is two radiators
It is row of pusher 4 fans ---> radiator ---> row of 4 puller fans. Now at this point air pressure is going to be no existent so there are an additional 3 booster fans to increase air velocity over the boards.
Only 1 radiator and 3 rows of fans. Then again we are looking at a crude schematic so who knows. It would be good for HF to clarify the intended design.
It is row of pusher 4 fans ---> radiator ---> row of 4 puller fans. Now at this point air pressure is going to be no existent so there are an additional 3 booster fans to increase air velocity over the boards.
Only 1 radiator and 3 rows of fans. Then again we are looking at a crude schematic so who knows. It would be good for HF to clarify the intended design.
Not speaking for hashfast but for rackmount servers airflow always has to be front to back without exception. A datacenter is going to use hot and cold aisles and they aren't going to reverse the flow on an entire row of racks (up to 400 servers) to accommodate a special request.
So either HF would need to put the modules up the airflow will be radiator first. My guess is they have no choice but to have radiator up front because 2U is only 3.5" high that probably means the radiator is no more than ~3" tall. A 19" case is ~17.5 wide but putting it in the back means losing 4" of width to the PSU. Not sure a 13" by 3" radiator is up to the task of dumping 750W.
Still your right the photo seems to directly contradict the description..
That's my understanding (front to back) which makes me assume the text statement of radiators being rear-mounted is the intended design. However, it then raises the question of why the render shows the radiators mounted in the front. It would be my guess that the sizing of the radiators would have to accommodate the placement of the PSU, and if the renders are any indication, then they have not accounted for PSU spacing and the radiators will in fact be at the front. There appears to be two rows of radiators, but I'm not versed enough in liquid cooling to speculate on whether dissipating that volume of heat is feasible given the approximate dimensions of the intended design.
Edit: Changed to discuss your longer post.
First chips should be in-hand by the Nov 1.
I can assume you have inside information then? How does your expectation of having the first run of chips in-hand at the beginning of November lend to Hashfast's "expected" delivery date of late October. Further, if the first run of chips is only to be arriving at the beginning of November, how does this effect the second lot of chips arriving in time for a mid-to-late November?
Also, the description claims a back mounted radiator but the render shows them as front mounted (drenching the modules in hot air). Any clarification from Hashfast as to why the render doesn't match the description, or more importantly, which orientation is the intended design?
Not speaking for hashfast but for rackmount servers airflow always has to be front to back without exception. A datacenter is going to use hot and cold aisles and they aren't going to reverse the flow on an entire row of racks (up to 400 servers) to accommodate a special request.
So either HF would need to put the modules up front or the airflow will be radiator first. My guess is they have no choice but to have radiator up front because 2U is only 3.5" high that probably means the radiator is no more than ~3" tall. A 19" case is ~17.5 wide but putting it in the back means losing 4" of width to the PSU. Not sure a 13" by 3" radiator is up to the task of dumping 750W.
Still your right the photo seems to directly contradict the description.
Also, the description claims a back mounted radiator but the render shows them as front mounted (drenching the modules in hot air). Any clarification from Hashfast as to why the render doesn't match the description, or more importantly, which orientation is the intended design?
So does anyone have any information regarding the cost and availability of the 1U control unit? It appears as though you get a free one if you order 10 Sierras, but there appears to be no mention of such a thing outside of this context.
I hope anyone who's ordered one of this things have done their due diligence in this matter. If you are one of those purchasers and have already inquired about the cost and availability of the control unit, would you mind sharing the details with the rest of us?
I hope anyone who's ordered one of this things have done their due diligence in this matter. If you are one of those purchasers and have already inquired about the cost and availability of the control unit, would you mind sharing the details with the rest of us?
We have a rolling GB for these going on thru dylexic and with me hosting (Super cheap), and we are allready halfway paid off one.
https://bitcointalksearch.org/topic/closedr3r4-extended-hf-flash-sale-pricing-2-hf-sierras-at-costhost-paid-299171
https://bitcointalksearch.org/topic/closedr3r4-extended-hf-flash-sale-pricing-2-hf-sierras-at-costhost-paid-299171
Baby Jets and Sierras are on sale for the next three days!
/much rejoicing
/much rejoicing
Thanks, bought a sierra
Baby Jets and Sierras are on sale for the next three days!
/much rejoicing
/much rejoicing
Thanks, good to hear.
Are you planning to sell units with lower binning chips for a discount? I'm guessing they're designed so you can still hash even with a large number of faulty hashing "cores".
When are you guys getting your first wafers back from the fab?
When are you guys getting your first wafers back from the fab?
Hi tacotime, nice to see you on this thread!
I think binning makes more sense for large numbers of chips, but we'll see what yields are and go from there.
First chips should be in-hand by the Nov 1.
What are the die size, package type, core voltage, transistor count, operating frequency, and projected TDP of the chip?
The package is a BGA, containing a multi chip module. There are 4 dies, each 9mm x 9mm, spaced out by 5mm. The core voltage and frequency vary according to the cooling available to the chip. The chip contains a temperature sensor on die, and increases or decreases the operating voltage and frequency to maintain a target operating temperature at the die. The allows the maximum possible performance to be achieved, given the cooling that is available. In a colder environment the chip will operate at a slightly higher voltage and frequency, and return a higher hash rate than in a warm environment. Simulation runs show that the best silicon will have a TDP of 250W when operating at the name plate (nominal) 400GH/s. Worst case silicon will consume a few % more power to reach this nominal 400GH/s. Note - simulation results can be out by +/- 20%, although they typically come in high (expect lower numbers in real silicon).
Are you planning to sell units with lower binning chips for a discount? I'm guessing they're designed so you can still hash even with a large number of faulty hashing "cores".
When are you guys getting your first wafers back from the fab?
What are the die size, package type, core voltage, transistor count, operating frequency, and projected TDP of the chip?
The package is a BGA, containing a multi chip module. There are 4 dies, each 9mm x 9mm, spaced out by 5mm. The core voltage and frequency vary according to the cooling available to the chip. The chip contains a temperature sensor on die, and increases or decreases the operating voltage and frequency to maintain a target operating temperature at the die. The allows the maximum possible performance to be achieved, given the cooling that is available. In a colder environment the chip will operate at a slightly higher voltage and frequency, and return a higher hash rate than in a warm environment. Simulation runs show that the best silicon will have a TDP of 250W when operating at the name plate (nominal) 400GH/s. Worst case silicon will consume a few % more power to reach this nominal 400GH/s. Note - simulation results can be out by +/- 20%, although they typically come in high (expect lower numbers in real silicon).
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