Also, exactly how scaleable is the klondike system? I know you have the k64. Would each k64 just plug into a different USB port on the host machine, or is it possible to just continue daisy-chaining the cards indefinitely, say, for example, into a 320 chip system, or something. Is there a point where, A: we need to use a separate USB port (to avoid signal degradation, or whatever), or B: where we just need to dedicate a new host machine to the system?
Sorry if this has already been answered.
The K64 is just 4x K16s on one board so the two can interconnect as if the same. For now I'm considering the limit on chaining the boards to be 8 K16 boards. I think that's a dependable number. However, it could easily be more as some people report having 25x I2C LED boards on an bus. I'll do testing when some are built. Regardless, at some point I'll put together a tiny I2C boost jumper that slips over the pins joining boards and expands this number. Also, initially I'll stick with 8-bit addressing and on I2C I think this means just a bit under 128 boards could be chained in theory, off a single USB connection. I doubt anyone will do that, and it probably makes more sense to run about 16 boards off a USB, and then use a USB hub to expand further, seeing as how they are dirt cheap and let you use the higher bandwidth of USB vs. I2C.
My question is how do you return the data from the ASICs? This might be the big 'unknown' until we have specs, but it seems to me passing that data back through the PIC would not be feasible. Can the data dump be passed directly to the USB controller? (I have about 15 other scenarios but would zzZZzz this thread so I will save them)
Also, I am in for some serious bulk PCB funding (cash in the Ks USD or BTC), but I would need to see a working prototype (even if its on a test board) before committing.
The result data gets back from the ASIC to the PIC via a secondary route as serial data. It is only a 4 byte nonce (I believe), and so is a very small amount to return back to the USB host.
I don't want to even talk about selling boards until I have a working prototype but everyone keeps asking so we have a lot of discussion about sales - that day will come and deals will be made. I will try to do what I can to get boards into assemblers hands so that miners can just buy boards and hook'em up.
Heatsinks?
I know you are still reworking the board for more important aspects but have you given more thought to the attachment of the heatsink Bkkcoins? Will we more likely to be bolting a single Aluminum heat sink to the back of the board? Where will the through holes be?
I'll try to put a drill file on github (but design could change if there is a better way to do it).
There is 4 corner holes and 4 spaced between the ASICs with the intention that the heat sink can be clamped down above each set of 4 ASICs. I think probably the 4 between ASICs are better suited for attaching the heat sink, and the corner ones for stacking with spacers or bolting to a case. But it could work out that bolting down the heat sink at the corners is feasible too. If the fins are cut back a bit there then spacers could be mounted on together with heat sink.
When I have a prototype I'll attach some test heat sinks and see what works best, and test with the new IR thermometer gun that some kind member here bought me.
BTW I'd welcome any sample/test heat sinks users want to send me so I can try them out and measure temperature with different air flows, etc.