I agree with sidehack on not mandating either option but providing for both in an economical way. I think you pretty much have the connectivity down pat with your A B C grouping situation. This means each rack unit can have a common backplane and wiring harness that can be purchased in bulk.
I am not sure on the cost differences between a wire harness, a slot adapter, or a terminal block on the backplane, but I think you could also solve the problem of people wanting to go with external supplies.
You can either offer an entirely new wiring harness for external supplies.
Or you could make the existing wiring harness attatch to the backplane with a connector, such that an additional wiring harness can expose the internal harness to the back of the unit by simply connecting in place of the backplane.
Or you could offer slot adapters with terminal blocks that could be used to adapt any supply to the backplane, leaving the internals hardwired. This would also allow you to expose P_GOOD and current sharing signals to the external harness.
A slightly more labor intensive option would be to simply build ALL backplanes with terminal blocks for tying in external supplies. Although that may impose an un-needed cost on all stock units with internal supplies. Either way, I think there is alot of flexibility involved with the whole concept of grouped boards tied to a 3 PSU slotted backplane.
Regarding the layout and flowpath for PSU's, it sounds like there is little need for cooling on components populating the slot adapter? I'm hearing that you want the most unobstructed flow path into the PSU intake. How critical is this? How much flow do we need? Can that number be quantified? I assume it's something along the lines of "Enough airflow to cool 600-700w of PSU waste heat at up to ~35 deg ambient intake temps".
I would need to work the numbers and run some simulations but intuitively I feel like if the PSU's generate negative pressure in the PSU cooling channel, the flowpath doesn't need to be absolutely perfectly straight.
I reworked the model with the PSU's flipped. I focused on trying to maximize the PSU intake tract, again, without knowing how much this really needs to breathe. As such, I envisioned the power leads coming of from underneath the backplane, routing to the outside, then penetrating through the top shelf to be routed to the front of the hashing cards, where they plug in. This provides balanced flow to all the PSU's, and it only means a little bit of cabling in the front of the PSU duct. Tradeoff is you make two seperate areas for the controller, unless they end up living in the hot zone between fans and hash cards. How hot do those exhaust temps tend to get? Is it an issue that the backplane compenents are hanging down into that hot zone now? Would they get cooked? My original thought was that you'd want absolute separation of the hotzone from all other components. How critical is it that the components above the heatsinks on the hashing card see airflow? Could they be in stagnant/low flow air? There is alot of space above the fans that could be sectioned off and made into a cooler space, but this would restrict airflow that comes in between the tops of the hashing cards and the heatsinks.
Thoughts?