Get something reasonably decent... I've had my eye on this:
http://www.amazon.com/X-TRONIC-MODEL-4010-XTS-Centigrade-ANTI-MAGNETIC/dp/B0053491YO
Topic: [ANN] Bitfury is looking for alpha-testers of first chips! FREE MONEY HERE! - page 18. (Read 176728 times)
September 08, 2013, 09:30:07 PM
September 08, 2013, 09:19:12 PM
Got it... SJ(55,19,20,21).
Looks like I will be investing in a soldering iron this week
Small steps....
Looks like I will be investing in a soldering iron this week
Small steps....
September 08, 2013, 09:16:42 PM
That would take out the 6th chip, which you said is hashing. You want to start bridging on the next set of jumpers, attempting to bypass chip 7. Without looking at a scope, no way to tell if it's the 6th or 7th chip that's the problem - you may end up having to bridge them both, but start by trying to bypass chip 7 which would be 55, 19, 30, and 21...
September 08, 2013, 09:11:22 PM
Thanks Kaerf -
Bridge all 4 (i.e. SJ16,SJ17,SJ18,SJ54)?
Bridge all 4 (i.e. SJ16,SJ17,SJ18,SJ54)?
September 08, 2013, 09:06:52 PM
Hey Guys...
I posted this in the bitfury retail saies threads, but this seems like the bitfury technical thread so I thought I would ask here too.
------
...To get my 25 GH, I received an H-board that is functioning at full capacity (~19GH) and an "EOL" end of line card with is running about 6 to 10 GH. After looking at the stats.log, it appears that the EOL card is only seeing the first 6 chips.
I took some macro hi-res pictures of the chips 6 and 7 (45 and 46 labelled on the card), where the spi communication I am guessing is broken.
http://i.imgur.com/Iddp2WQ.jpg
http://i.imgur.com/MpXXHdS.jpg
For the life of me, I don't see anything out of the ordinary.
The european thread seems more advanced at getting full speed out of these boards and was wondering if any experienced eyes see something suspicious.
-------
Anyway... the current advice seems to be that reflowing the 6 and 7 position asics would be a good first step. I am going to pickup a hot air rework station, and was wondering if anyone knew the flow temperature for the solder used on the H-boards (I guess that is directed mostly at c-scape or intron since they seem to have the most inside knowledge of these boards).
Anyone else have any advice for a biochemist/computer geek jumping into the EE world to get 10 additional asics hashing?
I posted this in the bitfury retail saies threads, but this seems like the bitfury technical thread so I thought I would ask here too.
------
...To get my 25 GH, I received an H-board that is functioning at full capacity (~19GH) and an "EOL" end of line card with is running about 6 to 10 GH. After looking at the stats.log, it appears that the EOL card is only seeing the first 6 chips.
I took some macro hi-res pictures of the chips 6 and 7 (45 and 46 labelled on the card), where the spi communication I am guessing is broken.
http://i.imgur.com/Iddp2WQ.jpg
http://i.imgur.com/MpXXHdS.jpg
For the life of me, I don't see anything out of the ordinary.
The european thread seems more advanced at getting full speed out of these boards and was wondering if any experienced eyes see something suspicious.
-------
Anyway... the current advice seems to be that reflowing the 6 and 7 position asics would be a good first step. I am going to pickup a hot air rework station, and was wondering if anyone knew the flow temperature for the solder used on the H-boards (I guess that is directed mostly at c-scape or intron since they seem to have the most inside knowledge of these boards).
Anyone else have any advice for a biochemist/computer geek jumping into the EE world to get 10 additional asics hashing?
just solder those solder jumpers (SJs) next to the bad chip. this turned my 15GH/s EOL board into a 25GH/s board.
September 08, 2013, 08:46:35 PM
Hey Guys...
I posted this in the bitfury retail saies threads, but this seems like the bitfury technical thread so I thought I would ask here too.
------
...To get my 25 GH, I received an H-board that is functioning at full capacity (~19GH) and an "EOL" end of line card with is running about 6 to 10 GH. After looking at the stats.log, it appears that the EOL card is only seeing the first 6 chips.
I took some macro hi-res pictures of the chips 6 and 7 (45 and 46 labelled on the card), where the spi communication I am guessing is broken.
http://i.imgur.com/Iddp2WQ.jpg
http://i.imgur.com/MpXXHdS.jpg
For the life of me, I don't see anything out of the ordinary.
The european thread seems more advanced at getting full speed out of these boards and was wondering if any experienced eyes see something suspicious.
-------
Anyway... the current advice seems to be that reflowing the 6 and 7 position asics would be a good first step. I am going to pickup a hot air rework station, and was wondering if anyone knew the flow temperature for the solder used on the H-boards (I guess that is directed mostly at c-scape or intron since they seem to have the most inside knowledge of these boards).
Anyone else have any advice for a biochemist/computer geek jumping into the EE world to get 10 additional asics hashing?
I posted this in the bitfury retail saies threads, but this seems like the bitfury technical thread so I thought I would ask here too.
------
...To get my 25 GH, I received an H-board that is functioning at full capacity (~19GH) and an "EOL" end of line card with is running about 6 to 10 GH. After looking at the stats.log, it appears that the EOL card is only seeing the first 6 chips.
I took some macro hi-res pictures of the chips 6 and 7 (45 and 46 labelled on the card), where the spi communication I am guessing is broken.
http://i.imgur.com/Iddp2WQ.jpg
http://i.imgur.com/MpXXHdS.jpg
For the life of me, I don't see anything out of the ordinary.
The european thread seems more advanced at getting full speed out of these boards and was wondering if any experienced eyes see something suspicious.
-------
Anyway... the current advice seems to be that reflowing the 6 and 7 position asics would be a good first step. I am going to pickup a hot air rework station, and was wondering if anyone knew the flow temperature for the solder used on the H-boards (I guess that is directed mostly at c-scape or intron since they seem to have the most inside knowledge of these boards).
Anyone else have any advice for a biochemist/computer geek jumping into the EE world to get 10 additional asics hashing?
September 08, 2013, 04:06:37 AM
cscape, what kind of solder paste you using for stencil ?
I've tried various kinds, but this is Multicore 96SC LF320 AGS88 lead free (Farnell order code 5091100) and so far I like it the best. The problem I have with some kinds of paste is that they are very runny, falling off the squeegee, and slumping when on the board. This one is nice and firm, but not dry.Heh
I tok some, testing few and didn't fund best.Temporary use Koki (standard S series) but I'm looking for something more stable with longer be used.http://www.ko-ki.co.jp/product/
September 07, 2013, 11:34:22 PM
cscape, what kind of solder paste you using for stencil ?
I've tried various kinds, but this is Multicore 96SC LF320 AGS88 lead free (Farnell order code 5091100) and so far I like it the best. The problem I have with some kinds of paste is that they are very runny, falling off the squeegee, and slumping when on the board. This one is nice and firm, but not dry. September 07, 2013, 05:11:31 PM
cscape, what kind of solder paste you using for stencil ?
September 07, 2013, 05:16:23 AM
So is there any advantage to mounting all the caps to the backside of the board so that a heatsink can be bolted down to the topside of those chips, or does the centre pad provide enough heat transfer through the board to make PCB back-side cooling better?
These chips are designed to dissipate heat through the ground pad and to the bottom of the board. In practice, cooling the board works well enough. September 07, 2013, 03:58:02 AM
So is there any advantage to mounting all the caps to the backside of the board so that a heatsink can be bolted down to the topside of those chips, or does the centre pad provide enough heat transfer through the board to make PCB back-side cooling better?
September 06, 2013, 04:20:18 PM
Project NanoFury moving along too:
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
Do you have a thread following this development? I'd like to follow.
Not yet ... I guess I should do that
September 06, 2013, 04:03:35 PM
Project NanoFury moving along too:
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
Do you have a thread following this development? I'd like to follow.
September 06, 2013, 03:35:10 PM
Project NanoFury moving along too:
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
I can hardly wait to get my hands on the boards
(ignore the somewhat iffy looking parts - I haven't figured out the proper 3d models yet)
By the way - speaking of filter capacitors: I figured 3 on each side should probably work just fine ... I guess I'll find out if it really does.
September 06, 2013, 02:38:43 PM
sounds like someone from The Netherlands, not?
of Belg kan natuurlijk ook.
of Belg kan natuurlijk ook.
September 06, 2013, 12:36:40 PM
What is Toch? Didn't see anything like that mentioned in the chip pinout, not sure if I'm missing something for the SPI connections?
"Toch?" is Dutch for "Right?"Oh, thanks for the translation. I barely have a handle on English and it is my first language
September 06, 2013, 12:14:07 PM
What is Toch? Didn't see anything like that mentioned in the chip pinout, not sure if I'm missing something for the SPI connections?
"Toch?" is Dutch for "Right?" September 06, 2013, 11:11:54 AM
Glad to hear I didn't screw up completely. Going to spend tomorrow morning placing/routing the PCB with the goal of submitting it to OSHPark for a run next week. Will report back once I have the gerber files.
Looks fine. Toch?
intron
What is Toch? Didn't see anything like that mentioned in the chip pinout, not sure if I'm missing something for the SPI connections?
Excellent point for the INCLK pin. I don't see myself driving the chip with an external clock source so I'll pull it to ground.
I used all 0603, and they're fine. My supply planes are nice and quiet.
I didn't fancy placing those tiny 0402 capacitors. Since I'm just doing a cheap OSHPark run of 3 boards, I hopefully won't lose too much if I run into issues.
This is my first attempt at a single-chip schematic. No joke, I was more or less copying the c-scape design for their initial test PCB. Electrically I think this is all correct? I'm going with the same decoupling capacitor values* that were mentioned in a post by intron.
Looks fine. Toch?
intron
What is Toch? Didn't see anything like that mentioned in the chip pinout, not sure if I'm missing something for the SPI connections?
Maybe add a solder jumper from INCLK to GND.
As far as calculating bypass caps, to do a proper job you need to know the layout of the board and the exact specifications of the capacitor. As they say: "ain't nobody got time for that!"
As far as calculating bypass caps, to do a proper job you need to know the layout of the board and the exact specifications of the capacitor. As they say: "ain't nobody got time for that!"
Excellent point for the INCLK pin. I don't see myself driving the chip with an external clock source so I'll pull it to ground.
since we're on the topic - I'm assume switching to 0603 size caps doesn't pose a problem, correct?
After hand soldering 150 0402 caps, I'm ready to not ever do that again
After hand soldering 150 0402 caps, I'm ready to not ever do that again
I used all 0603, and they're fine. My supply planes are nice and quiet.
I didn't fancy placing those tiny 0402 capacitors. Since I'm just doing a cheap OSHPark run of 3 boards, I hopefully won't lose too much if I run into issues.
September 06, 2013, 10:05:11 AM
since we're on the topic - I'm assume switching to 0603 size caps doesn't pose a problem, correct?
After hand soldering 150 0402 caps, I'm ready to not ever do that again
After hand soldering 150 0402 caps, I'm ready to not ever do that again
I used all 0603, and they're fine. My supply planes are nice and quiet.
September 06, 2013, 09:39:44 AM
0603 size has a somewhat higher inductance, so it may not perform as well as 0402. Whether that's significant, I don't know.
Soldering 0402 has one advantage though: after you pick and place 10000 of them, suddenly 0603 seem as huge as bricks.
Soldering 0402 has one advantage though: after you pick and place 10000 of them, suddenly 0603 seem as huge as bricks.
indeed - i can now do 1206 with my feet!
thnx, will read up a bit on package characteristics.
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