Quote from: Exception;17173
They took 1 of the 6 wafers from the bumping facility to wire it up for testing.
Q: Why?
A: They did this because bumping was taking awhile and they wanted to be able to give the fab the go ahead to put the final layers on the other 6 wafers in waiting.
Q: What happened?
A: They say the test went fine, everything is okay.
Q: So did they tell the fab to finish putting the final layers on the 6 wafers in waiting?
A: No...
Q: Why?
A: They said they're going to wait to do final testing of the first 5 wafers leaving the bumping facility going onto packaging before initiating the final layer production at the fab.
What does this tell you?
Either they're idiots and just threw away 1/6th of their first run for no reason or... something didn't go as they had planned with the wire bond testing.
Q: Why?
A: They did this because bumping was taking awhile and they wanted to be able to give the fab the go ahead to put the final layers on the other 6 wafers in waiting.
Q: What happened?
A: They say the test went fine, everything is okay.
Q: So did they tell the fab to finish putting the final layers on the 6 wafers in waiting?
A: No...
Q: Why?
A: They said they're going to wait to do final testing of the first 5 wafers leaving the bumping facility going onto packaging before initiating the final layer production at the fab.
What does this tell you?
Either they're idiots and just threw away 1/6th of their first run for no reason or... something didn't go as they had planned with the wire bond testing.
https://forums.butterflylabs.com/bfl-forum-miscellaneous/1221-there-problems-asic-chips-2.html#post17173
Quote from: cedivad;17170
No, everything is going just fine.
https://forums.butterflylabs.com/bfl-forum-miscellaneous/1221-there-problems-asic-chips.html#post17170
The growing sentiments are frightening.
