agreed, and I think you might be right. I found this. Its old but might have some helpful information.
https://bitcointalksearch.org/topic/knc-asic-users-thread-faq-307055. So are you saying in the advanced page , the temps to the far right are the vrm temps? If thats true, and I think it might be, where are the temps of the 4 cores found, or do they average it on the status page? I think the next update might need clear labels on these numbers , as KNCminer gave us temps, but for what!!? Everything is not labeled in the miner, and its needs to be to clear up all of this confusion.
Vegas
The pages are already correctly labeled LOL! DCDC = VRM's ... loosely interchanged to refer to the same thing.
The temperature column on the status page grabs those temps directly from a LM75 sensor... I dont know where this sensor is on the board, could u inspect the underside of the board perhaps? maybe there is 1 LM75 sensor mounted beneath the ASIC package. Its reading temps through the board, or maybe somehow the LM75 is integrated within the ASIC package.
But there has to be one LM75 sensor somewhere on these damn boards.
Either way, I suspect its an external sensor for the ASIC package. It functions to readout external package temps which are usually a good 10-30C less than actual die temps.
Out of curiousity how much did your temps change by when u slid the HSF around?
I have 2 theories,
1. when sliding HSF around this could potentially change airflow caused by your hand etc... and therefore the DCDC's were being cooled more or not depending on that airflow aversion.
2. If slid the HSF caused temperatures to skyrocket for a short period the dies may have went into a limp mode to avoid being blown up.
I suspect there is no on die temp sensor, otherwise we would see it being used. We arent.
Hey vegas, w/ ur thermal sensor thing, can you read temps from atop the base of the HSF while its hashing? Actually, if u could aim the laser at the package underneath the heatsink as its hashing, that would be really telling. If its close to the readout of TEMPERATURE on status page then the ASIC is using a single external package temp monitor. (thats already my suspicioun anyways, but it would prove the theory)
What I wish we knew was the TDELTA between the dies & the package temp sensor. If I knew what that DELTA was on average, I could code it into the firmware to reflect the correct average temp of the dies.