Where do I get this shirt? I've got to own one.
Topic: ACTUAL Butterfly Labs PCB pics! - page 6. (Read 40283 times)
sr. member
Activity: 350
Merit: 250
Trust me, these default swaps will limit the risks
@ bce
I would think that if you start cutting on the circuit board you will void the warranty.
I would think that if you start cutting on the circuit board you will void the warranty.
Now thats funny
god dammit... i'm wearing that shirt RIGHT NOW. *shame*
@ bce
I would think that if you start cutting on the circuit board you will void the warranty.
I would think that if you start cutting on the circuit board you will void the warranty.
I would be more worried about voiding the functionality of the ASICs than the warranty on the board... If only I could get some blank boards to mess with
. I'm sure everyone will be careful with their SC singles when they first arrive, but it's only a matter of time before people try some modifications. I've got a couple of 5870s with stock VRM / RAM cooling and arctic cooling heatsinks.... running very cool all around - a hacksaw job that is definitely not warrantied, but running whisper quiet at 1000MHz
. I'll miss the days of the GPU in bitcoin mining. 
I'm just curious as to why the sub script isn't used: 112
Oh Hai!
A superscript and subscript feature, doh.
Thanks for the remedial forums training
I C I got it erred. TY4 fixing.
I'm just curious as to why the sub script isn't used: 112
Oh Hai!
A superscript and subscript feature, doh.
Thanks for the remedial forums training
@ bce
I would think that if you start cutting on the circuit board you will void the warranty.
I would think that if you start cutting on the circuit board you will void the warranty.
Now thats funny
11mm^2
Is that the die size? Or is the package 11x11?
That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.
Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.
Like Inaba said: (11mm)^2
lol
I'm just curious as to why the sub script isn't used: 112
11mm^2
Is that the die size? Or is the package 11x11?
That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.
Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.
Like Inaba said: (11mm)^2
lol
@ bce
I would think that if you start cutting on the circuit board you will void the warranty.
I would think that if you start cutting on the circuit board you will void the warranty.
11mm^2
didn't take long for Inaba to count the pixels
I counted pixels and arrived at the same conclusion:
I don't see a die-size prediction. I'm going with 24mm^2
From the board pictures, the chip packages appear to my eyes to be 11x11mm.
Not that that says a whole lot about the die size.
@ bce
I would think that if you start cutting on the circuit board you will void the warranty.
I would think that if you start cutting on the circuit board you will void the warranty.
11mm^2
Is that the die size? Or is the package 11x11?
That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.
Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.
Package size. Do I get half a bounty?
Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later. Would it be possible to just do chip swaps? Pop off the old one and insert the new, smaller, faster one?
If this were intended, the chips would be socketed.
Yeah, and with a nice slab of copper in the middle of the socket
I'm still trying to imagine how to cool the bottom side of these chips. If there are no traces directly under the ASIC chip, I'd like to cut a square hole under each chip and get at least some copper down there... The hole size would be limited by pressure on the ASIC being applied from the HSF on the top side. The bottom heatsink could simply be a small square about the height of the board's depth above a larger square that adheres flush with board, and with some fins beneath. It'd be like a 2 level pyramid with fins on bottom.
This is just my best guess for how I'd modify things on the board if I could magically change the existing design.
Copper island and vias can transfer as much as 30% of heat from the chip on the other side of the PCB. Just add heatsinks on the other side.
Package size. Do I get half a bounty?
Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later. Would it be possible to just do chip swaps? Pop off the old one and insert the new, smaller, faster one?
If this were intended, the chips would be socketed.
Yeah, and with a nice slab of copper in the middle of the socket
I'm still trying to imagine how to cool the bottom side of these chips. If there are no traces directly under the ASIC chip, I'd like to cut a square hole under each chip and get at least some copper down there... The hole size would be limited by pressure on the ASIC being applied from the HSF on the top side. The bottom heatsink could simply be a small square about the height of the board's depth above a larger square that adheres flush with board, and with some fins beneath. It'd be like a 2 level pyramid with fins on bottom.
This is just my best guess for how I'd modify things on the board if I could magically change the existing design.
Package size. Do I get half a bounty?
Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later. Would it be possible to just do chip swaps? Pop off the old one and insert the new, smaller, faster one?
If this were intended, the chips would be socketed.
Package size. Do I get half a bounty?
Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later. Would it be possible to just do chip swaps? Pop off the old one and insert the new, smaller, faster one?
I wish BFL had used ceramic packaging instead of plastic. How much more can mil-spec ASIC's cost?
Package size. Do I get half a bounty?
11mm^2
Is that the die size? Or is the package 11x11?
11mm^2
didn't take long for Inaba to count the pixels
Jump to: