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Topic: [ANN] Bitfury is looking for alpha-testers of first chips! FREE MONEY HERE! - page 56. (Read 176727 times)

full member
Activity: 224
Merit: 100
You can't kill math.
bitfury, about your bet, it was edited by BitBet staff right? You did not write this part?

Quote
BitFury's ASIC will be demonstrated to mine Bitcoin either publicly, in an open to the public event announced at least two weeks in advance, or privately as confirmed by unaffiliated, well respected members of the community (this specifically excludes known shills such as Luke-jr) and will consume less than 1 W per GH/s for powering the chip and the board (excluding any cooling appliances). CHIP ZARABOTAET I BUDET POTREBLYAT < 1 W / GH/s. Initiated by Bitfury, who placed the first Yes bet.
sr. member
Activity: 266
Merit: 251
How many cores are in the chip and how many clock cycles does it take to get a result?
Does each core has GPIO or is there some serial but that aggregates them?
Does your QFN48 7x7mm packaging has exposed thermal pad and is it on top or bottom?

1. 756 double sha256 cores. 61+4 kernel (61 clock cycle computation 4 clock cycle load).

2. There's asynchronous 'match' signal - the only thing that core sends out. And some busses to load data.

3. wirebond. die is laid normally in cavity. i.e. it is not flip-chip and not arranged to give heat into anything else, but PCB.
It is actually not complex to dissipate 3W... Maybe even 5W with metal-core PCB and proper cooling. That's what we'll see.

756 double cores in 7x7mm package?, how many gates approximately in each double core and what are the die dimensions?
You should probably read a little on the design philosophy bitfury used in his previous FPGA design. I believe he fit 82 cores in an LX150.

die dimensions - 3.8x3.8 mm
160x99um approx. kernel size (that's two sha256).
dimensions are as in die (scaled down to 55nm from 65nm).

Gates - I cannot say easily that's full-custom design and can't extract that count easily. NAND2 approximation would be 4, but my cells are actually more complex.
Number of non-cap transistors found from cell kern32: 54558

And... there's still some things can be done better, but more risky - it's kind conservative design as I am doing this first time in my life and want to have as best success chances as I may get.
So it can be done better - but that's I think is what I'll do for smaller tech nodes. Also... 15% of die went to auxiliary circuits such as padframe, ESD, some control, etc.
legendary
Activity: 1792
Merit: 1047
Keep up the great work Bitfury.
legendary
Activity: 1274
Merit: 1004
How many cores are in the chip and how many clock cycles does it take to get a result?
Does each core has GPIO or is there some serial but that aggregates them?
Does your QFN48 7x7mm packaging has exposed thermal pad and is it on top or bottom?

1. 756 double sha256 cores. 61+4 kernel (61 clock cycle computation 4 clock cycle load).

2. There's asynchronous 'match' signal - the only thing that core sends out. And some busses to load data.

3. wirebond. die is laid normally in cavity. i.e. it is not flip-chip and not arranged to give heat into anything else, but PCB.
It is actually not complex to dissipate 3W... Maybe even 5W with metal-core PCB and proper cooling. That's what we'll see.

756 double cores in 7x7mm package?, how many gates approximately in each double core and what are the die dimensions?
You should probably read a little on the design philosophy bitfury used in his previous FPGA design. I believe he fit 82 cores in an LX150.
hero member
Activity: 697
Merit: 500
Interested in a few chips AFTER the testing is completed. I'm just a hobbyist, can't actually provide any useful feedback but would enjoy buying a few chips to make some 1-4 chip devices for fun. Congratulations guys, I hope it works!
full member
Activity: 130
Merit: 100
How many cores are in the chip and how many clock cycles does it take to get a result?
Does each core has GPIO or is there some serial but that aggregates them?
Does your QFN48 7x7mm packaging has exposed thermal pad and is it on top or bottom?

1. 756 double sha256 cores. 61+4 kernel (61 clock cycle computation 4 clock cycle load).

2. There's asynchronous 'match' signal - the only thing that core sends out. And some busses to load data.

3. wirebond. die is laid normally in cavity. i.e. it is not flip-chip and not arranged to give heat into anything else, but PCB.
It is actually not complex to dissipate 3W... Maybe even 5W with metal-core PCB and proper cooling. That's what we'll see.

756 double cores in 7x7mm package?, how many gates approximately in each double core and what are the die dimensions?
So there is no metal pad in or on the package to move the heat from silicone? Just plastic all around the die?
full member
Activity: 155
Merit: 100
I would love to give these a test. I'm an electrical engineer by trade and have an entire EE lab at my disposal to get some of these up and running  Grin Let me know
full member
Activity: 224
Merit: 100
You can't kill math.
Congrats on making a chip so fast, even though I am technically your competitor, I am happy for the whole eco system.

Here is why everyone who bet on Bitbet that your chip will run "< 1 W / GH/s" will loose:
....

Thanks, but .... we may still loose technically because there's 15th June to give proof and bitbet.us says it can't extend resolution time unfortunately, it's a bit unfair as mainly packing screw up... At least unfair to those who placed bets... I think that I will compensate to all who bet for 'Yes' in case if chip works as expected, so they would get expected betting returns. As this is pretty my responsibility for delays.

Wow really? That's really nice if you do. Smiley

Good luck!
legendary
Activity: 1274
Merit: 1004
I am very interested in this. I'm currently developing a miner using another ASIC chip, but would love to try out another device if for nothing else than due diligence.

I will PM you details.
full member
Activity: 154
Merit: 100
sr. member
Activity: 266
Merit: 251
How many cores are in the chip and how many clock cycles does it take to get a result?
Does each core has GPIO or is there some serial but that aggregates them?
Does your QFN48 7x7mm packaging has exposed thermal pad and is it on top or bottom?

1. 756 double sha256 cores. 61+4 kernel (61 clock cycle computation 4 clock cycle load).

2. There's asynchronous 'match' signal - the only thing that core sends out. And some busses to load data.

3. wirebond. die is laid normally in cavity. i.e. it is not flip-chip and not arranged to give heat into anything else, but PCB.
It is actually not complex to dissipate 3W... Maybe even 5W with metal-core PCB and proper cooling. That's what we'll see.
sr. member
Activity: 350
Merit: 250
This is great news! Looking forward to the test results.
sr. member
Activity: 249
Merit: 250
full member
Activity: 238
Merit: 100
Love the Bitcoin.
full member
Activity: 130
Merit: 100
How many cores are in the chip and how many clock cycles does it take to get a result?
Does each core has GPIO or is there some serial but that aggregates them?
Does your QFN48 7x7mm packaging has exposed thermal pad and is it on top or bottom?

Edit: I see you answered above some of the questions, please answer the other once.
sr. member
Activity: 308
Merit: 250
decentralizedhashing.com
I'm more impressed with BitFury every day, I'll gather their info for the list...  I haven't seen anyone give credible evidence of anything wrong with their information.
legendary
Activity: 1176
Merit: 1001
CryptoTalk.Org - Get Paid for every Post!
sr. member
Activity: 266
Merit: 251
How many leads does the chip have and what package type ?


QFN48 7x7 mm plastic package.

Pad diagram: https://mega.co.nz/#!SctDlaJY!TMVG_E6gOVI-MMky8BS0hTy_h-AqpBeVfgrKF_d0J7g

central pad - ground
35 pads - VDD - on three sides - core voltage - 0.6 .. 0.9 V with high amperage.

I/O (required for testing):

IOVDD - feed it with 1.8 V
IOREF - feed it with 0.9 V for standard signalling (better not take VDD but put resistive divider between GND and IOVDD) and some cap to remove pulsations.
INCLK - input clock (in case if internal oscillator not works)

INMOSI, INSCK - SPI inputs
INMISO - SPI output (to controller)

then 'bonus' pins for further testing are:

OUTCLK, OUTSCK, OUTMOSI, OUTMISO - are for chaining SPI communication to next chip (chaining mode is programmable within chip). OUTMISO should be tied to GND.

and

CMQ, CMPLUS, CMMINUS - are internal regulator. it is beyond the scope right now as it could be rocket science to make it work using realistic noise... these should be tied to GND.

If mounting is dead-bug - don't forget to solder FAT THICK WIRE to center of the chip to dissipate power! Otherwise you'll prepare "fried chips" food Smiley
newbie
Activity: 21
Merit: 0
This is great news. We're a US based group of technologists and engineers. We've been talking to bitfury during the past few months of their ASIC development and are very excited that they are finally on their way.
We're working with a group of engineers and firmware developers who have finished their last hardware project, bladeRF @ nuand.com. These guys have experience with embedded hardware, FPGA and hardware design.
We'd be delighted at the opportunity to test and evaluate these chips and think that yet another player in the ASIC market is good news for bitcoin.
sr. member
Activity: 378
Merit: 250
How many leads does the chip have and what package type ?
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