Test PCB layout with all above:
http://imgur.com/TPcptbvI don't have Gerber files, I can just send the CAD files to the
PCB production facility. They can do boards as thin as 0.2 mm.
I don't have partnumbers for the passives yet, could be anything
I guess.
PM me please.
intron
Look - what I think about capacitors... Right in your placement with cross-section and 2 layer PCB (assuming 1.6 mm height):
4.4 mm x 1.6 mm = 7 mm^2 current loop from capacitor to power.
if you put capacitor right below chip - it would be 1.6 x 1.6mm current loop area. Roughly almost 2.8 times better.
Can't say directly inductances involved - but I believe that inductance for 4.4 x 1.6 mm current loop of this kind to be like 1.5 - 4 nH
In case if you put below the chip capacitor - it will have 0.5 - 1.6 nH additional serial inductance.
But - IF YOU USE 4-layer PCB and top layerstack would have say 0.1 mm dielectric - then current loop area would be much much less!
I just don't know your layerstack, but have this in mind - that power and ground layers should be CLOSE to each other, otherwise (if that's 2-layer pcb) - capacitors could live only on BOTTOM. Or PCB should not be thick - distance between layers affects this much.
Yes, I see that. But when bottom layer is kept free from components
the entire board can be mounted on a heat sink. Just like they did with
the Avalon Blades, have a look at the pictures. When you start mounting
stuff on layer bottom you also need a cooling device on top of the
chip. And then you migth end up where BFL is right now: Thermal Problems Galore...
This board can be bi-layer or 4-layer or whatever is needed.
I should suggest a quick, low-cost bi-layer and go from there.
intron