Common sense?
Well, someone shouldn't state something like that as if it is a fact without something to back it up...
But, it seems if you look at the post above you, it was a joke. I guess I'm out of the loop.
Topic: BFL Requests Input - page 6. (Read 34805 times)
Well, someone shouldn't state something like that as if it is a fact without something to back it up...
But, it seems if you look at the post above you, it was a joke. I guess I'm out of the loop.
Especially since you'll be shipping product in about 4 weeks.
Correction: 4-6 weeks.Did I miss this announcement, or does ckolivas know something that we don't?
I guess he would have a better idea than most, since he will/has receive a dev unit.
Could you elaborate on how you know BFL won't be shipping for 4-6 weeks?
Common sense?
Especially since you'll be shipping product in about 4 weeks.
Correction: 4-6 weeks.Did I miss this announcement, or does ckolivas know something that we don't?
I guess he would have a better idea than most, since he will/has receive a dev unit.
Could you elaborate on how you know BFL won't be shipping for 4-6 weeks?
So ASIC support will be in 4-6 weeks? Or are you talking of availability of asics?
It's a joke, for the longest time BFL shipment time for the Singles was listed as 4 to 6 weeks despite being months late.
Especially since you'll be shipping product in about 4 weeks.
Correction: 4-6 weeks.Did I miss this announcement, or does ckolivas know something that we don't?
I guess he would have a better idea than most, since he will/has receive a dev unit.
Could you elaborate on how you know BFL won't be shipping for 4-6 weeks?
end of October/Beginning of November time frame
I was under the assumption, as I"m sure many here were, that this "visit" would occur prior to any product shipping, in order to show the community what you've got.
I'm pretty sure we are now in beginning on November. Will this happen soon? If not, I think it will be a waste of time for all involved. Especially since you'll be shipping product in about 4 weeks.
Personally I would have been more inclined to be happy if the "visit" was by an independent test house, say TUV Rhineland or SGS.
Those guys have ample experience in evaluation of production/quality & shipping installations not to mention DUPRO capability.
This smacks too much of grandstanding.
HC
Especially since you'll be shipping product in about 4 weeks.
Correction: 4-6 weeks. 
end of October/Beginning of November time frame
I was under the assumption, as I"m sure many here were, that this "visit" would occur prior to any product shipping, in order to show the community what you've got.
I'm pretty sure we are now in beginning on November. Will this happen soon? If not, I think it will be a waste of time for all involved. Especially since you'll be shipping product in about 4 weeks.
Yochdog and Kano are the ones selected,but no exact info on when,yet 
One flying in from Australia and the other from Idaho. Hell, I'll go and pick up The Joint and we can drive there in my Caddy.
Kano is an excellent choice. He's certainly a no nonsense type of guy. He's not BFL's biggest fan, but he seems pretty damn honest and straight forward to me.
If BFL has the goods, I'm sure he tell us exactly that.
If BFL has the goods, I'm sure he tell us exactly that.
Yochdog and Kano are the ones selected,but no exact info on when,yet
... so who's going?
Coz the discussion moved on over to the BFL forum.
The result is that Yochdog was chosen from the votes.
The result is that Yochdog was chosen from the votes.
I know the result - but haven't heard any news re. visiting BFL labs (not here and not on forums@bfl).
Do you know when Yochdog is going?
Still waiting for firm dates from Josh. Hoping we get it nailed down soon.
Also, what do you guys think about Casascius and Meni Rosenfeld?
I trust these 2 a LOAD more than
but I guess I'm 23 pages late to the game... so who's going?
EDIT: I mixed people up, corrected
I thought the Cairnsmore1 used 4 heatsinks, 1 fan?
It does - one heatsink per chip, all cooled by a single fan blowing air downwards onto them.What a great idea! I guess that's what happens when you actually have experience in the field.
I thought the Cairnsmore1 used 4 heatsinks, 1 fan?
It does - one heatsink per chip, all cooled by a single fan blowing air downwards onto them.Mmm, so it does. I should have looked more closely at the pics.
To use a different example then, the Radeon GPUs use a single heatsink block to cool quite a few different chips, with "thermal pads" used to help insure firm surface contact and transfer of heat.
I thought the Cairnsmore1 used 4 heatsinks, 1 fan?
It does - one heatsink per chip, all cooled by a single fan blowing air downwards onto them. Potentially a recipe for a manufacturing disaster.
Since there are 8 chips ALL relying on a SINGLE heatsink, a tiny variation in manufacturing could leave the chips at slightly different hights, resulting in chips that may not make contact with the bed of the heatsink, or worse!!, chips that are slightly higher and have the BGA connections compressed and fractured because they get compressed to be at the same hight as the surrounding devices.
Since there are 8 chips ALL relying on a SINGLE heatsink, a tiny variation in manufacturing could leave the chips at slightly different hights, resulting in chips that may not make contact with the bed of the heatsink, or worse!!, chips that are slightly higher and have the BGA connections compressed and fractured because they get compressed to be at the same hight as the surrounding devices.
Cairnsmore1 uses a similar design, cooling 4 chips (484-BGA I think) with a single heatsink/fan. Does it have these kind of problems?
I thought the Cairnsmore1 used 4 heatsinks, 1 fan?
The Cairnsmore1 can do 60GH/s ?
Wow I'm glad I did not buy an ASIC.. next you will be telling me that a .13um design is better than a 90nm process.........
Potentially a recipe for a manufacturing disaster.
Since there are 8 chips ALL relying on a SINGLE heatsink, a tiny variation in manufacturing could leave the chips at slightly different hights, resulting in chips that may not make contact with the bed of the heatsink, or worse!!, chips that are slightly higher and have the BGA connections compressed and fractured because they get compressed to be at the same hight as the surrounding devices.
Since there are 8 chips ALL relying on a SINGLE heatsink, a tiny variation in manufacturing could leave the chips at slightly different hights, resulting in chips that may not make contact with the bed of the heatsink, or worse!!, chips that are slightly higher and have the BGA connections compressed and fractured because they get compressed to be at the same hight as the surrounding devices.
Cairnsmore1 uses a similar design, cooling 4 chips (484-BGA I think) with a single heatsink/fan. Does it have these kind of problems?
I thought the Cairnsmore1 used 4 heatsinks, 1 fan?
Not at that level of heat dissipation.
Potentially a recipe for a manufacturing disaster.
Since there are 8 chips ALL relying on a SINGLE heatsink, a tiny variation in manufacturing could leave the chips at slightly different hights, resulting in chips that may not make contact with the bed of the heatsink, or worse!!, chips that are slightly higher and have the BGA connections compressed and fractured because they get compressed to be at the same hight as the surrounding devices.
Not to mention the "incursions" of the Ceramic capacitors UNDER the heatsink & at a HIGHER level than the chips requiring cooling.
(So HOW did they strap on a 'heatsink' to test the device?)
Don't EVEN get me started about the track routing around the heatsink fixing holes
Custom shaped heat sink and thermal pad?
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