story so far - 8/19
chips have arrived via other routes as previously announced, we are shipping them out at the rate of 40-50k on a daily basis at the moment, in addition to the ~150k or so that went out, another 40k was shipped today. There is multiple channel which the chips are arriving from various packaging facility to minimize downtime. Please bare this in mind: while we had backup/multiple packaging companies and various delivery routes, things still will go wrong. There is also testing that must be done, then they can split, packed and sent to the EZP coupled with their CN-22 and be on their way. We will provide more update as they come. In addition, the trade-in and refunds are being processed.
If this is true, many folks on this forum should start receiving chips in the next week or two.
Is he saying there needs to be "testing" done on the chips??...
Bunch of lies as always.
"testing" lol he is trying to lie that they will take each chip out of the tray and 'test' it and then put it back into tray and ship to us.
What is this I don't even...
I try translate it for you:
Various companies take wafer from TSMC cut, packing (assembly silicon structure in the QFN48 package) and testing.
I have an understanding of some aspects of technology... and understand that 'technology' is a pretty large term which encompasses many different types of 'technology'. I assume you are saying people here do not understand the chip manufacturing process? Explain why you do? It seems like TSMC's states this on their website:
We will spread dedication to quality to every facet of the company and achieve a culture of continuous improvement to assure customer satisfaction. There is only one ultimate goal: Zero defect - in everything we do.
We will adopt expedient containment programs to shield our customers from any defects until each has been eliminated. We all share the responsibilities to achieve this goal.
Sounds like the words of a company that tests their stuff before sending out... but I obviously was not involved in Avalon's ordering process, what they paid for, how TSMC handled their order, etc... just curious where your expertise comes in and what exactly needs to be tested with these chips after leaving TSMC? Wouldn't TSMC at least do some type of wafer acceptance test?