![](https://ip.bitcointalk.org/?u=http%3A%2F%2Fs27.postimg.org%2Ft5u3a9ekv%2F20140413_115652.jpg&t=640&c=kIkOi_5OBB6AEA)
I don't understand the heat sink configuration here though?
Why are the heat-sinks on the A1 chips so small?
What is the bigger heat sink on the other side connected to?
70% from the other
This seems to be done right
CONGRATS. AMT
![Grin](https://bitcointalk.org/Smileys/default/grin.gif)
This is useless of course as all my other posts right?
I don't understand this kind of a configuration, there is no conduction path from the chip through the board to the massive heat sinks.
There is a thick copper "Ground Plane" and the small holes are called "vias" the ASIC chips are designed to pass 80% of their heat (watt dissipation) thru the board to the large sink. CPU and GPU Dissipate thru the Tplate or Top Plate covering the silicon.
Those tiny copper H/S are failsafe, and do 20% of the work.
The Vias fill with solder when chips are mounted, completing the heat transfer part.