What I did
https://i.imgur.com/M4hAltp.jpg
https://i.imgur.com/UxAirwg.jpg
https://i.imgur.com/0P54Tic.jpg
What I would do next time.
(upper right)
https://i.imgur.com/8dEDdmW.jpg
It's a clay sammich on clay bread.
Recipe:
Harvest some clay from along the fan side for improved airflow.
Save it CLEAN in a ziplock.
DO NOT REMOVE AS MUCH AS I DID at first.
You will have 4 more to perfect technique and test.
Cut some slices and place where needed on remaining clay bread.
Bake @ 70C for 6 months on an Ericsson griddle.
Serve open face with local garnish
Tools needed:
PAPER TOWELS
razor blade
Torx T-10 (with big enough handle and tall enough to easily clear top of heatsink with hand)
Optional/likely, more goo when ya bump the heatsink removing screws.
To remove plate:
Remove cover.
Bend sides out to make room for hand.
Hold base of heatsink in place with one hand while removing screws with other.
SLOWLY lift up on plate at one of the ends of the fingers.
When it starts to lift loosen other finger.
Slow and gentle so as not to remove heatsink when it lets loose.
Once the plate has been tipped a bit the other end is easy to lift.
Lift er up and slide her out for clay harvesting goodness.
Extra harvesting tips:
The remaining clay needs to remain along the outside edge of the plate.
Never lifting it is best if possible, it can droop down during installation and not cover VRM.
(next to sammich in pic)
The plate screws need to tighten all the way down to hold the heatsink flat when re-installing.
Too thick a sammich not better if you crush the VRMs.
Thin sammich all around might help too, thickening on fingers only.
I added a single AC box fan $20.00 USD to help the cubes and ran @ 500 while air cooling with ambient > 83C
The lower right of wish pic shows result of bendage method.
I left the PCB low in the case and left lower clay in place but added some airflow to cool bottom of case.
(my setup was temporary, else lift the PCB up too if possible)
YMMV