After all, didn't they get some quantity of sample chips in back in December when it was determined that the original package type chosen had inadequate heat dissipation?
What, did they fry *all* of them?
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And that would be sufficient for the software guys to work with.
The communication protocol won't have changed, just the physical implementation, with the chips in their new package type.
From what little Josh has said in the last few days, they're going to test with some unpackaged chips once the bumping is done.