Not a problem. On the bottom of the case you will see 6 screws for each blade. Two per blade are in a keyhole, just loosen those and remove the other four.
Inside the case pull out the power and data connectors from the blade, if there is hot glue on the connectors just pull it off. Unscrew the small heatsink first, then unscrew the large one. Once unscrewed they are loose, not bonded or anything :-)
Yes, I already saw how it is assembled. I have to be careful with static discharges, 28nm chips are very sensitive.
Also unclear is how much mechanical pressure you can put on the chips when reassembling without cracking them.
The Chinese like to use thermal glue everywhere, after heating it with a fohn it will peel off easily.
I can see that there is a thermal pad between the top heat sink and the chips.
I assume there is no pad between the PCB and the bottom heat sink? At least I don't see it.
Are all these big copper pads on the bottom of the PCB ground pads?
Edit: I looked more closely and see now that there is also a thermal pad on the bottom.
Maybe a good idea to put some MX-2 underneath the copper pads of the voltage regulators as well.